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Special Reports

Backside Power Delivery Creates Fab Tool, Thermal Dissipation Barriers

By: Laura Peters

Moving the power delivery network to the backside of a chip reduces congestion, but it introduces new challenges for fabs.

When Cleaning Chips Isn’t Clean Enough

By: Gregory Haley

Contamination is a systems-level limiter at advanced nodes, and there's no simple solution to fix it.

The Race Begins For Much Bigger Abstractions In Data Centers

By: Ed Sperling

Massive compute capabilities enable a whole new way of manipulating and using data, and a potential bonanza for AI data...

Auto Security Accelerates With Standardization And Certified Silicon

OEMs are driving faster design cycles and enhanced security amid evolving vehicle archi...

March 5th, 2026 By Ann Mutschler

Limiting AI/ML Tools To Ensure Physical AI Safety, Security

Tools designed to verify and monitor physical AI systems offer value, but human oversig...

March 5th, 2026 By Liz Allan

New Automotive Architectures Are Shaking Up Processor And Memory Choices

Exponential increases in data and a mix of performance requirements are driving a top-t...

March 5th, 2026 By Ann Mutschler

Tool And Methodology Changes Coming In Fab And Package Automation

How new equipment and methodologies are improving reliability, yield, and time-to-marke...

March 4th, 2026 By Gregory Haley

Making Hybrid Bonding Better

Why this technology is so essential for multi-die assemblies, and how it can be improved.

March 2nd, 2026 By Laura Peters

Using Data And AI More Effectively In EDA

EDA produces a lot of data, but how useful is that for AI to consume? The industry look...

February 26th, 2026 By Brian Bailey

AI Starting To Simplify Design Of Programmable Logic

Engineering specialization is still required, but time to market will shrink for FPGAs ...

February 26th, 2026 By Liz Allan

Verifying Scale-Up And Scale-Out In Data Centers

Navigating a sea of standards and options in a rack and between racks.

February 26th, 2026 By Ed Sperling

Back-End Automation Tackles Growing Complexity

As packaging complexity rises, the industry faces gaps in data, inspection, and process...

February 25th, 2026 By Gregory Haley

Laser Arrays May Simplify Co-Packaged Optics

Monolithic tunable lasers can adapt statically and dynamically.

February 19th, 2026 By Bryon Moyer

Why Indium Oxide Chips Are Getting So Much Attention

Much work still needs to be done to make these materials reliable enough for commercial...

February 19th, 2026 By Katherine Derbyshire

Can A Computer Science Student Be Taught To Design Hardware?

To fill the talent gap, CS majors could be taught to design hardware, and the EE curric...

February 17th, 2026 By Liz Allan

Chiplets And 3D-ICs Add New Electrical And Mechanical Challenges

Reliability is now a system-level concern that includes everything from materials and p...

February 12th, 2026 By Ann Mutschler

UCIe’s Major Technical Components Are Now In Place

Version 3.0 of the interconnect standard doubles bandwidth and supports new use cases a...

February 12th, 2026 By Bryon Moyer

Minimum Energy Per Query

How much of the energy consumed in an AI chip is spent doing something useful? This que...

February 12th, 2026 By Brian Bailey

Catching Critical Defects In TSVs And Stacked Chips

Variation is a bigger problem in advanced packages with multiple chiplets; AI can help.

February 10th, 2026 By Laura Peters

Resistance In Advanced Packages Is Now A System-Level Problem

Multi-die assemblies require the measurement of subtle changes at the precise point whe...

February 10th, 2026 By Gregory Haley

Chiplets Add More Inspection And Test Steps

What's required to improve the yield of multi-die assemblies.

February 10th, 2026 By Anne Meixner

Securing Hardware For The Quantum Era

Quantum computers may become a security threat as early as next year, and that threat w...

February 5th, 2026 By Ann Mutschler

Consumer, Med Tech Mushrooms As Quantum Closes In

Bio-inspired medical devices can gather more data than ever before, and HPC/quantum wil...

February 5th, 2026 By Liz Allan

Latest News

Chip Industry Week In Review

AI integrity attacks; bid for Rohm; US weighs more AI chip authority; on-chip security controls; new chips at MWC; optical interconnect deals; CPO funding; 18A; d...

March 6th, 2026 By The SE Staff

Blog Review: Mar. 4

AI memory tradeoffs; formal certainty; 7nm university chip; thermal constraints; calibrating process models.

March 4th, 2026 By Jesse Allen

Chip Industry Week In Review

Rapidus' new $1.7B infusion; Intel and UMC leadership moves; faster EUV; $100B GPU deal; Arm-Tensor robocar; smartphone market to decline; HBF; $1B in AI chip fun...

February 27th, 2026 By The SE Staff

more news »

Opinion

Data Centers In Space?

Someday, but not soon. Chip execs don’t need to start design...

March 9th, 2026 By Geoff Tate

Follow The AI Leader

Who will lead the integration of AI with EDA? That story has ...

March 3rd, 2026 By Brian Bailey

more opinions »

more research »

Startup Corner

Startup Funding: Q4 2025

More and bigger funding rounds for AI chips and AI for making ...

By Jesse Allen

Startup Tips To Get From Seed Funding To Series A, B, C

Everyone has a bright idea about how to save power or boost pe...

By Liz Allan

more startups »

Special Reports

Top Stories

Auto Security Accelerates With Standardization And Certified Silicon

Limiting AI/ML Tools To Ensure Physical AI Safety, Security

New Automotive Architectures Are Shaking Up Processor And Memory Choices

Tool And Methodology Changes Coming In Fab And Package Automation

Making Hybrid Bonding Better

Using Data And AI More Effectively In EDA

AI Starting To Simplify Design Of Programmable Logic

Verifying Scale-Up And Scale-Out In Data Centers

Back-End Automation Tackles Growing Complexity

Laser Arrays May Simplify Co-Packaged Optics

Why Indium Oxide Chips Are Getting So Much Attention

Can A Computer Science Student Be Taught To Design Hardware?

Chiplets And 3D-ICs Add New Electrical And Mechanical Challenges

UCIe’s Major Technical Components Are Now In Place

Minimum Energy Per Query

Catching Critical Defects In TSVs And Stacked Chips

Resistance In Advanced Packages Is Now A System-Level Problem

Chiplets Add More Inspection And Test Steps

Securing Hardware For The Quantum Era

Consumer, Med Tech Mushrooms As Quantum Closes In

Latest News

Chip Industry Week In Review

Blog Review: Mar. 4

Chip Industry Week In Review

Opinion

Data Centers In Space?

Follow The AI Leader

Research

Research Bits: Mar. 9

Chip Industry Technical Paper Roundup: Mar. 9

Research Bits: Mar. 3

Startup Corner

Startup Funding: Q4 2025

Startup Tips To Get From Seed Funding To Series A, B, C

Videos

New Challenges In Signoff

New Performance Requirements For Audio

Wi-Fi 7 Moves To The IoT

Changes In Chip Architectures At The Edge

Knowledge Centers / Entities, people and technologies explored

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